Call for Papers (pdf)

The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world, especially from Asia, to exchange innovative ideas on system, board, and device testing with design, manufacturing and field consideration in mind.

Scope

Original papers on, but not limited to, the following areas are invited.

Automatic Test Pattern Generation Fault Modeling and Simulation Design Verification and Validation Diagnosis and Debug Board and System Test Analog/Mixed-Signal Test High-Speed I/O Test RF Test Delay and Performance Test Memory Test/FPGA Test System-in-Package/3D Test Software Testing

Boundary Scan Test Built-In Self-Test Design-for-Testability Test Compression On-Line Test Temperature/Power-Aware Testing Defect-Based Testing Fault Tolerance Dependable System Yield Analysis and Enhancement Test Quality Economics of Test

Submissions

Regular Sessions: The ATS'13 Program Committee invites original, unpublished paper submissions on the above topics. Paper submissions should be complete manuscripts, not exceeding six pages (including figures, tables, and bibliography) in a standard IEEE two-column format. The submission will be considered evidence that upon acceptance the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium. The registration of at least one author is required for publication.

Special Sessions, Tutorials: Suggestions and proposals are welcome. Contact the Program Chair for more information.

Key Dates

Submission deadline: Notification of acceptance: Camera ready manuscript:

May 24, 2013 June 4 June 7 August 5, 2013 August 31, 2013

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