Symposium Overview
The Asian Test Symposium (ATS) provides an open forum for researchers and
industrial practitioners from all countries of the world, especially from Asia, to
exchange innovative ideas on system, board, and device testing with design,
manufacturing and field consideration in mind.
Original papers on, but not limited to, the following areas are invited.
- Automatic Test Pattern Generation
- Fault Modeling and Simulation
- Design Verification and Validation
- Diagnosis and Debug
- Board and System Test
- Analog/Mixed-Signal Test
- High-Speed I/O Test
- RF Test
- Delay and Performance Test
- Memory Test/FPGA Test
- System-in-Package/3D Test
- Software Testing
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- Boundary Scan Test
- Built-In Self-Test
- Design-for-Testability
- Test Compression
- On-Line Test
- Temperature/Power-Aware Testing
- Defect-Based Testing
- Fault Tolerance
- Dependable System
- Yield Analysis and Enhancement
- Test Quality
- Economics of Test
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