Program Highlight

Keynote
Test Data Analytics - from Mathematical Tools to Applications
Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Invited Speeches
New Approaches to Improving Quality and Accelerating Yield Ramp to Meet Process Technology Disruptions
Wu-Tung Cheng, Chief Scientist and Test Research Director, Mentor Graphics

3DIC's System Design Impact and Testing Needs
William Wu Shen, Test Chip Design Verification Division, TSMC

Oral Presentations
Seventeen technical and two industry sessions that cover nearly all
aspects of key area in VLSI testing, from 3D-IC to ATPG.

Full-Day and Embedded* Tutorials
Statistical Adaptive Tet Methods Targeting "Zero Defect" IC Quality
and Reliability
Adit D. Singh, Auburn University

Testing TSV-Based 3D Stacked ICs
Krishnendu Chakrabarty, Duke University

Data Mining in Test - Principles and Practices*
Li-C Wang, University of California, Santa Barbara

Software Testing*
Farn Wang, National Taiwan University

Vendor Session on New Test Technologies & Roadmap