Asian Test Symposium 2000

Program Committee


Vishwani D. Agrawal, AT&T Bell Laboratory, va@research.bell-labs.com
Rob Aitken, HP, aitken@dtc.hp.com
Melvin A. Breuer, University of Southern California, mb@poisson.usc.edu
Sreejit Chakravarty, Intel Corp., schakra@scdt.intel.com
Tsin-Yuan Chang, Natioanl Tsing-Hua University, tyc@ee.nthu.edu.tw
Jwu-E Chen, Chung-Hua University, jechen@chpi.edu.tw
Kwang-Ting (Tim) Cheng, University of California, Santa Barbara,timcheng@ece.ucsb.edu
Wu-Tung Cheng, Mentor Graphics, wu-tung_cheng@mentorg.com
Bruce Cockburn, University of Alberta, cockburn@ee.ualberta.ca
Serge Demidenko, Singapore Polytechnic, Singapore, S.Demidenko@massey.ac.nz
J. Figueras, UPC Diagnoal, Spain, figueras@ee1.upc.es
Hideo Fujiwara, Nara Institute of Science and Technology, Japan, fujiwara@is.aist-nara.ac.jp
A.J. van de Goor, Delft University of Technology, Netherland, vdGoor@CARDIT.et.tudelft.nl
Hiromi Hiraishi, Kyoto Sangyo University, Japan, hiraishi@ics.kyoto-su.ac.jp
Andre Ivanov, University of British Columbia, ivanov@ee.ubc.ca
Wen-Ben Jone, Natioanl Chung-Cheng University, jone@cs.ccu.edu.tw
Jing-Yang Jou, Natioanl Chiao-TungUniverstiy, jyjou@bestmap.ee.nctu.edu.tw
Seiji Kajihara, Kyushu Institute of Technology, Japan, kajihara@cse.kyutech.ac.jp
Bozena Kaminska, Opmaxx Inc., bozena@opmaxx.com
Kozo Kinoshita, Osaka University, Japan, kozo@ap.eng.osaka-u.ac.jp
Sandip Kundu, Intel Corporation, skundu@scdt.intel.com
Chung-Len Lee, National Chiao-Tung University, cllee@cc.nctu.edu.tw
Bin-Da Liu, Natioanl Cheng-Kung University, bdliu@cad.ee.ncku.edu.tw
Yashwant Malaiya, Colorado State University, malaiya@cs.colostate.edu
Ed McCluskey, Stanford University, ejm@james.stanford.edu
Yinghua Min, Academia Sinica, China, min@mimi.cnc.ac.cn
Michael Nicolaidis, TIMA, France, michael.nicolaidis@imag.fr
Irith Pomeranz, University of Iowa, irith@eng.uiowa.edu
Paolo Prinetto, Politecnico di Torino, tttc@chiusella.polito.it

Janusz Rajski, Mentor Graphics, rajski@wv.mentorg.com
C.P. Ravikumar, Indian Institute of Technology, India, rkumar@ee.iitd.ernet.in
Sudhakar M. Reddy, University of Iowa, reddy@eng.uiowa.edu
K. K. Saluja, University of Wisconsin, saluja@engr.wisc.edu
Jacob Savir, New Jersey Institute of Technology, savir@megahertz.njit.edu
Sharad C. Seth, University of Nebraska-Lincoln, seth@cse.unl.edu
Tsuyoshi Shinogi, Mie University, Japan, shinogi@hayashi.elec.mie-u.ac.jp
Mani Soma, University of Washington, soma@ee.washington.edu
Hiroshi Takahashi, Ehime University, Japan, takahashi@cs.ehime-u.ac.jp
Mike Wong W. T., Hong-Kong Polytech University, Hong-Kong, enmike@polyu.edu.hk

Sying-Jyan Wang, Natioanl Chung-Hsing University,sjwang@cs.nchu.edu.tw
Xiaoqing Wen, Syntest , wen@syntest.com
Ching-Long Wey, Michigan State University , wey@ee.msu.edu
Tom W. Williams, Synopsys Inc., tww@synopsys.com
Shiyi Xu, Shanghai University of Science and Technology, China, syxu@fudan.ac.cn

Teruhiko Yamada, Meiji University, Japan, yamada@cs.meiji.ac.jp
Seiken Yano, Cochi University, Japan, yano@ele.kochi-tech.ac.jp
Massaki Yoshida, NEC Corp., Japan, myos@lsi.nec.co.jp

Yervant Zorian, Logic Vision, zorian@lvision.com








IE4.0 or higher Strongly Recommended
National Cheng Kung University, Tainan, Taiwan, R.O.C
No.1 RD.University, 70101 ,Tainan Taiwan
   
   
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